A presidential determination (PD) was signed, authorizing the use of Defense Production Act to support the nation’s domestic Printed Circuit Boards (PrCB) and Advanced Packaging industrial base. The PD allows the Department of Defense (DoD) to utilize its Defense Production Act (DPA) Title III authorities to invest in advanced microelectronics capacity and ensure the production of state-of-the-art integrated circuits in the United States. PrCBs are critical components in all electronics used in the national defense, economic, environmental, energy, and healthcare management sectors. Advanced packaging allows multiple devices to be packaged and mounted on a single electronic device. Advances in materials, manufacturing tooling, and process development are imperative in advanced packaging to support rapidly evolving technology and the continuously shrinking feature sizes. Click here to read more.